This is an amazing tacky flux for surface mount rework.
We are able to remove and resolder a number of parts that were impossible using normal liquid flux.
Some TSOP's, PLCCs, SSOP's...all were a ton easier to remove and resolder.
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• Remove QFDs, PLCCs, SOICs and chip components without costly equipment
• Use with existing rework equipment or temp controlled soldering irons
• Special removal alloy has excellent wetting ability
• Safe, affordable, easy and won't damage sensitive components

Features:

1: This product is no-clean solder paste, very little residue, without washing.

2: The residue is colorless and transparent appearance outstanding.

3: Excellent printing performance with suitable hand and machine print.

Is currently the best on the market BGA, CSP rework help paste.

Just apply a little each time

Specifications:

Capacity: 10CC

Model: NC-559-ASM

Color: As shown

Suitable for BGA ball, semiconductor packaging, repair.

Computer motherboard north and south bridge, communications,

graphics and other BGA apply.

RETURN & WARRANTY

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OUR GUARANTEE

• We take pride in our products as we believe they are amazing.
• However, we understand that buying things online can be daunting, especially for the first time, so we offer a 100% satisfaction guarantee.

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